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Toshiba, a world leader in Semiconductors, works closely with top companies to deliver a complete business solution that mitigates design risk and ensures high-yield manufacturing of Custom System-on-Chip, ASIC designs, COT and Foundry services.

Custom System-on-Chip and ASIC Capabilities
Industry leader in producing high-performance system-level ICs in 40, 65, 90 and 130 nm process
New 300-mm wafer fab for production of Custom SoCs and foundry
Flexible hand-off model starting from RTL to a traditional ASIC netlist
Eleven-layer copper CMOS technology
Low-k dielectric and logic densities up to 800,000 gates/mm2
Cost-effective embedded DRAM cores of less than 20mm sq for 32Mb in 65 nm
Input/output cells support high-performance SerDes chip-to-chip interface applications as well as GigaEther, FibreChannel, Sonet and Wi-Fi.
High-performance and high pin-count packages
Cost-effective 1 Gb DRAM integration with an ASIC in a stacked die SCS package
Commercial EDA design flow with signal integrity support and power analysis
Local design support centers

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