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Power Electronics Technology Online Buyer's Guide Press Releases

Read the latest Business News and Product Developments for Manufacturers of automotive electronic systems; communication / telecommunications. Networking systems; computers and peripherals; consumer electronics; office systems; customer power systems; electric appliances; factory automation.
New DC Cabling Solution by Amphenol, Powered by Ampt, Reduces Costs of PV Systems
Teseq Holding AG Acquires MILMEGA to Expand RF Power Amplifier Capabilities
Maxim to Present at Upcoming Investor Conferences
Microsemi and TRINAMIC Deliver Dual Motor Control Kit
Maxim's Hi-Speed USB Protectors Deliver Automotive-Grade Protection for Mobile Connectivity
VPT's New DC-DC Converter Provides Zero Cross Regulation Error
Thermacore Named a Top Thermal Management Supplier
TransDigm First Quarter Earnings Report and Conference Call Set for Tuesday, February 7, 2012
Microsemi to Present at the Stifel Nicolaus Technology & Telecom Conference
Microsemi Introduces Energy-efficient PoE (EEPoE) Midspans at Cisco Live London Show
Motorola Mobility Announces Fourth Quarter and Full-Year Financial Results
Maxim Reports Results for the Second Quarter of Fiscal 2012
Micrel Reports 2011 Fourth Quarter and Full Year-End Financial Results
Microsemi Reports First Quarter 2012 Results
ITU Approves G3-PLC as a New Worldwide Smart Grid Standard
TransDigm Group Incorporated Announces New Board Member
Altium Releases New Range of Board-level Components in Collaboration With STMicroelectronics
STMicroelectronics Reports 2011 Fourth Quarter and Full Year Financial Results
TransDigm to Acquire AmSafe Global Holdings, Inc.
Microsemi Announces Webcast and Access Information for First Quarter Earnings Conference Call
Microsemi Acquires Timing, Synchronization and Synthesis Business from Maxim Integrated Products
Maxim's 3D Integration Technology Enables Industry's Smallest Class D Amplifier Solution
Microsemi Earns ZTE's "2011 Best Delivery Support" Award
STMicroelectronics Demonstrates Performance of Ultimate Connected Home Platform
Micrel Schedules Fourth Quarter 2011 Earnings Release and Conference Call
Microsemi Receives "Strategic Partner" Award from FiberHome
Microsemi Announces Breakthrough Technology Platform for RF Front-end Modules
Fox TCXOs Now Available in Smaller Form Factor for GPS Applications
MOLX, MOLXA FY12 Q2 Press Release Information
Microsemi's Folsom, Calif. Facility Attains AS9100:2009 Rev C Certification
AnalogicTech Concludes Internal Investigation and Moves Forward With Filing Its Third Quarter 10-Q
New Aries CSP Sockets Enable Testing of Any Area-array Device to +200 degrees C
New Module Triples EMC Testing Range to 18 GHz in Digital Receiver from Teseq
STMicroelectronics Launches Corporate Venture Capital Fund
Micropac Industries, Inc. Approves Special Dividend
STMicroelectronics Produces World's First Wafer Employing Fully Contactless Testing
Motorola Mobility and VTech Expand Business Relationship
TransDigm Completes Acquisition of Harco Laboratories, Incorporated
STMicroelectronics Introduces World's Smallest 3-Axis Digital Gyroscope
Motorola Mobility Global Research Outlines Dramatic Shift in Traditional TV Viewing Experience
STMicroelectronics Sets Fast Route to Market for NAGRA's OpenTV 5 Set-Top Box Middleware
STMicroelectronics to Showcase its Advanced Solutions at PV Japan 2011
Amphenol's HelioLug First UL 2703 Certified Grounding Component for Solar Installations
Motion Sensing on Smaller and Sleeker Gadgets to Result from STMicroelectronics Innovation
STMicroelectronics Announces Winners of 2011 iNEMO™ Campus Design Contest in China
New Plug-and-Play Junction Box from Amphenol Provides Versatility, Modularity
Micrel Promotes General Counsel And Corporate Secretary Colin Sturt To Vice President
Teseq Develops CDNE Coupling/Decoupling Network for Emission Testing
TransDigm Group Reports Fiscal Fourth Quarter and Year-End Results
AnalogicTech Receives Notice from Nasdaq Regarding Delay in Filing of Form 10-Q
VPT's Space Grade DC-DC Power Converters Now Registered With Defense Logistics Agency
+/-25 ppm XpressO Oscillators from Fox Electronics Operate Over Wide Temperature Range
TransDigm Fourth Quarter Earnings Report and Conference Call Set for Thursday, November 17, 2011
AnalogicTech Reports Financial Results for the Third Quarter 2011
TransDigm to Acquire Harco Laboratories, Incorporated
New Compact Three-phase EMI Filters from LCR Suppress EMI Emissions
Maxwell Technologies Reports Third Quarter Financial Results
AnalogicTech Responds to Skyworks' Latest Spurious Allegations
LumaSense Technologies Acquires Thermal-Imaging and Services Assets of La.-based Reliability Point
Cummins Power Generation Unveils Acoustical Testing Center at Fridley, MN HQ
Micrel Reports 2011 Third Quarter Financial Results
Amphenol's Upgraded Power Mount Connectors Provide More Secure Connection
Teseq Offers New ESD Simulator with Built-in Discharge Relay
Motorola Mobility to Issue Third-Quarter 2011 Earnings Results on Oct. 27
Micrel Schedules Third Quarter 2011 Earnings Release and Conference Call
AnalogicTech Announces Date of Annual Meeting of Stockholders
Motorola Mobility Makes Powerful a Lot More Fun and Affordable with Motorola ATRIX™ 2
AnalogicTech Postpones Date of Annual Meeting of Stockholders
Fox Offers 1-volt Oscillators with Low Current Consumption in New Compact Package Size
Amphenol's Helios H4 Connector Ranked Highest in Independent Test Comparison
Teseq's New Power Amplifier Delivers Reliability and Consistency
New Inrush Current Limiter Protects Avionics and Military Power Systems
AnalogicTech Announces Response to Skyworks Latest Accusations
AnalogicTech Announces Developments Relating to its Pending Acquisition
MOLX, MOLXA FY12 Q1 Press Release Information
Amphenol's New Data Link Connector Ideal for Extremely Rugged Environments
Fox Electronics Adds New Sales Office in Silicon Valley
Motorola Mobility Extends IPTV Set-top Roll-out With VimpelCom
TransDigm Completes Acquisition of Schneller Holdings LLC
New Rugged Connector from Amphenol Features High Amperage; Low Mating Force
New Thermal Imaging System Uses Sharper Video Imagery to Improve Coal Plant Efficiency
TransDigm Group Authorizes New Share Repurchase Program
Series 350 Submersible KPSI Transducer Features SDI-12 Small Bore Interface
Power Supply For Railway Applications From Martek Provides Up To 100W
Martek Power joins the United Nations Global Compact
Cooper Industries Announces Acquisition of Martek Power
Toshiba Electronics Announces DPAK+ MOSFETs for Industrial Applications
DVGAs from National Semiconductor Enable Higher-Performance Basestation Radio Architectures
AnalogicTech Reports Financial Results for the Second Quarter 2011
AnalogicTech Names Nationz Partner of the Year for 2010
TransDigm Group Reports Fiscal 2011 Third Quarter Results
Compact XpressO XO HCMOS Oscillators from Fox Electronics Now Available in 2.5-volts
Newest LumaSense Pyrometer Provides Higher Accuracy in Harsh, High-Temperature Environments
National Semiconductor Expands Sensor AFE Family
Amphenol's New Connector Meets Updated Base Station Requirements
Micrel Reports 2011 Second Quarter Financial Results
Maxwell Technologies Reports Second Quarter Financial Results
Teseq's Compliance 5 EMC Test Software Adds DO-160 Module for Aerospace Applications
National Semiconductor Agreement with Audi AG Launches with the Next Innovative 2012 Car Models
Toshiba Introduces Series of Nch Standard MOSFETs for Mobile Devices
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